US stops providing US companies licences to export to Huawei: report

FILE PHOTO: Hi1710 BMC management chip is seen on a Kunpeng 920 chipset designed by Huawei's Hisilicon subsidiary is on display at Huawei's headquarters in Shenzhen, Guangdong province, China May 29, 2019. Picture taken May 29, 2019. REUTERS/Jason Lee