Chinese semiconductor designer Montage Technology is looking to raise as much as HK$7.04 billion ($901.95 million) in its Hong Kong listing, according to a filing with the exchange on Friday.
The Shanghai-listed chipmaker is offering 65.9 million H-shares at a maximum offer price of HK$106.89 apiece.
The proceeds will be used to enhance Montage’s commercialization capabilities, such as boosting its sales and marketing teams, along with strategic investments and acquisitions as well as working capital, the filing said.
Final pricing is slated for February 6, with shares set to debut on the Hong Kong Stock Exchange on February 9.
Reuters reported earlier this month that the Shanghai-listed firm was planning a second listing in Hong Kong, riding on an uptick in fundraising in the city.
Chinese artificial intelligence and semiconductor companies are tapping a resurgent Hong Kong equity fundraising market, spurred on by the AI boom and Beijing’s push to build up China’s technology capabilities in response to U.S. curbs on high-end chips and chipmaking equipment.
Hong Kong led global IPO fundraising in 2025, with $37.2 billion raised from 115 new listings, according to LSEG data.
January saw market debuts of Chinese “AI tiger” MiniMax Group, semiconductor specialist OmniVision Integrated Circuits, and AI chipmaker Biren among many others.
Founded in 2004, Montage Technology designs fabless integrated circuits, which are used to speed data flow between chips in servers and data centres.
($1 = 7.8053 Hong Kong dollars)
Reuters
