AI-based chip developer Houmo.AI announced on Tuesday that it has completed a pre-Series A round of financing, raising a corpus of 300 million yuan ($46 million) led by Qiming Venture Capital.
Register now to enjoy 3 free articles per month,
or log in to continue reading.
Stay informed with complimentary articles each month
Gain access to our exclusive newsletters delivered directly to your inbox
Be the first to know about all our summits!
Already a Subscriber? Log in
